柔性电路

Conductron™ DP/DP-H Direct Plate Process

 
 
 

Conductron™ DP / DP-H Direct Plate are processes especially designed for operation in vertical and horizontal equipment respectively. The Conductron™ Process can be applied for panel plating as well as pattern plating. The system is suitable for double sided, flex/rigid-flex as well as multilayer boards.

关键好处:

  • Provides excellent copper-to-copper adhesion
  • 处理时间短
  • 简化的过程控制
  • 工艺化学品消耗低
  • Reduced chelate content for easy waste treatment
  • 无甲醛
图像组件